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Journal of Microelectronics and Electronic Packaging

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JOURNAL INFORMATION
Publisher IMAPS-International Microelectronics and Packaging Society
Open Access NO
Quartile Q3
Citation Count 35
P-ISSN 1551-4897
E-ISSN 1555-8037
Categories Computer Networks and Communications, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
Area Computer Science, Engineering, Materials Science
Region Northern America
Country United States
Summary

  1. Journal of Microelectronics and Electronic Packaging is published by IMAPS-International Microelectronics and Packaging Society
  2. It is not an oppen access journal
  3. The Subject Area : Computer Science; Engineering; Materials Science